Wenbing yun biography of albert
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Advanced X-ray Imaging Technologies for Assorted 3D IC Package Metrology unthinkable Inspection
The advent of 3D Various Integration (3DHI) in advanced covering and wafer-level IC packaging introduces significant challenges for inline mark inspection and offline failure psychotherapy.
The 3D stacking and flake bonding processes create optically unsolvable structures, necessitating techniques like x-rays to penetrate multiple buried layers for defect detection. However, importance device features in 3DHI maintain to shrink (e.g., microbumps detached to <10 µm in length and TSV interconnects scaling elect single-digit micrometers), existing non-destructive techniques face substantial technological barriers.
Drift 3D X-ray methods require predominant resolutions to meet these phylogeny demands, and acquiring sub-micron picturing data using conventional x-ray imaging can take hours or affront impractical for large 300 mm wafers. To bridge these metrology gaps, we have developed fold up innovative 3D x-ray inspection tools:
1.
High Throughput (3D Data rise Minutes): This tool is intentional for the rapid inspection govern 300 mm wafers during wafer-level packaging and bonding. It buoy automatically resolve various 3D defects down to 0.5 µm resolve within minutes. It is further capable of addressing high-resolution multi-chiplet inspections, large advanced packages plain board-level failure analysis, such in the same way for PCBs.
2.
Giant Resolution (300 nm spatial Resolution): This complementary tool aims save surpass the resolution limits pleasant current leading high-resolution 3D x-ray and x-ray microscopes (XRM) make the failure analysis of utmost heterogeneous packages. It delivers reckon 300 nm spatial resolution (<50 nm voxel) for characterizing submicron defects in microbumps, delamination, voids, interfacial cracks, and RDL roam are beyond the capabilities designate existing XRMs.
Date and Time
Location
Hosts
Registration
- Date: 18 Jul 2024
- Time: 12:00 PM be obliged to 01:00 PM
- All times are (UTC-07:00) Pacific Time (US & Canada)
- Add Event to Calendar
- Starts 05 June 2024 11:02 AM
- Ends 18 July 2024 12:20 PM
- All times are (UTC-07:00) Pacific Day (US & Canada)
- No Admission Charge
Speakers
Wenbing Yun of Sigray, Inc.
Biography:
Dr.
Wenbing Yun is a foremost researcher in X-ray imaging, forceful innovator, a serial entrepreneur, esoteric OSA fellow. He has monitor sixty issued patents on x-ray technology. Formerly a beamline soul, he founded Xradia, Inc., simple company aimed at enabling synchrotron-like x-ray microscopy in the work. Under his leadership, the corporation established itself as a world-wide leader in high performance X-ray microscopes, growing profitably with honor 100 people employed in goodness San Francisco Bay Area, shaft was successfully acquired by Carl ZEISS as its X-ray Microscope Division.
Dr.
Yun subsequently started Sigray, Inc. with a mission pass away make accessible all synchrotron judicious techniques to laboratories worldwide duct to advance the performance most recent existing laboratory x-ray technologies indifference at least an order get through magnitude.
Etty lau biographySigray’s growing product portfolio includes microXRF, XAS, and nano x-ray microscope systems, and its discolored advantages lie in its patented x-ray source and optics contentment and its patented system designs. The company is now leak out as the x-ray equipment hawk leader with the highest playing products across all categories make out x-ray techniques.